Microscale thermofluidics in integrated water cooling of 3D electronic chips

Metadata Label Value
Author(s): Renfer, Adrian
Publisher: ETH
Citation:

Renfer, Adrian. Microscale thermofluidics in integrated water cooling of 3D electronic chips. ETH (2013). http://dx.doi.org/10.3929/ethz-a-009900656

Document Type: Doctoral and Habilitation Theses  
Documents: Abstract (151.81KB) , Fulltext (29.65MB)
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Detailed Information

Metadata Description
Title Microscale thermofluidics in integrated water cooling of 3D electronic chips
Author(s) Renfer, Adrian
Publication Place Zürich
Publisher ETH
Publication Date 2013
Notes Diss., Eidgenössische Technische Hochschule ETH Zürich, Nr. 21203, 2013
Language English
DOI http://dx.doi.org/10.3929/ethz-a-009900656
Subject(s) Microelectronics, Integrated Circuits
Thermodynamics, Statistical Physics
Keyword(s) MICROFLUIDICS AND NANOFLUIDICS
MECHANICAL VIBRATIONS IN LIQUIDS
CHIP STACKS
VORTEX FLOW
Organisational Unit Department of Mechanical and Process Engineering
Online Publication Date 2013
Description File Name MIME Type Size
Abstract   eth-7071-01.pdf application/pdf 151.81KB
Fulltext   eth-7071-02.pdf application/pdf 29.65MB
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E-Collection record created: Sat, 29 Jun 2013, 04:27:10 CET