Numerical modeling of 3D integrated water cooling of electronic chip stacks

Metadata Label Value
Author(s): Alfieri, Fabio
Publisher: ETH
Citation:

Alfieri, Fabio. Numerical modeling of 3D integrated water cooling of electronic chip stacks. ETH (2013). http://dx.doi.org/10.3929/ethz-a-009910080

Document Type: Doctoral and Habilitation Theses  
Documents: Abstract (51.89KB)
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Detailed Information

Metadata Description
Title Numerical modeling of 3D integrated water cooling of electronic chip stacks
Author(s) Alfieri, Fabio
Publication Place Zürich
Publisher ETH
Publication Date 2013
Notes Diss., Eidgenössische Technische Hochschule ETH Zürich, Nr. 21202,2013
Language English
DOI http://dx.doi.org/10.3929/ethz-a-009910080
Subject(s) Microelectronics, Integrated Circuits
Fluid Dynamics, Plasma Physics
Keyword(s) MICROFLUIDICS AND NANOFLUIDICS
CHIP STACKS
COOLING
ELECTRONIC EQUIPMENTS
FLOW THROUGH POROUS MEDIA
REYNOLDS NUMBER
TURBULENT FLOW
Organisational Unit Department of Mechanical and Process Engineering
Online Publication Date 2013
Description File Name MIME Type Size
Abstract   eth-7136-01.pdf application/pdf 51.89KB
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E-Collection record created: Wed, 17 Jul 2013, 04:25:28 CET